High‑speed active optics for AI data centers, 5G transport, and metro networks
100G to 1.6T – OSFP, QSFP-DD, SFP56 form factors
Hot‑pluggable OSFP modules supporting 1.6T (16x100G) and 800G (8x100G) with PAM4 DSP or linear drive options. DR8, 2xFR4, and SR8 variants.
QSFP-DD form factor for high‑density switching, supporting 400G SR4/DR4/FR4 and 800G SR8/DR8. Compliant with 100G PAM4.
Compact SFP transceivers for 25G and 50G PAM4 applications, ideal for 5G fronthaul and enterprise access.
Coherent digital optics for metro and long‑haul, 100G–400G ZR/ZR+ with integrated DSP.
Integrated photonic engines, CPO, and hybrid integration
High‑density SiPho chips with integrated modulators, germanium photodetectors, and edge couplers. Customizable for CPO and LPO.
Directly attached optical engines to switch ASIC, eliminating retimers and reducing power by >30%. 3.2T aggregate.
Die‑to‑die optical interconnects using silicon photonics micro‑chiplets for high‑bandwidth, low‑latency chip‑to‑chip links.
High‑gain drivers and low‑noise amplifiers for 50G/100G PAM4 and coherent
Linear drivers for directly modulated and electro‑absorption modulated lasers, supporting 50Gbaud PAM4.
Low‑noise, high‑bandwidth TIAs for 100G/lane and 200G/lane applications. AGC and RSSI options.
Quad‑channel drivers and TIAs for coherent optics, supporting DP‑QPSK and 16QAM modulation.
Single‑mode DFB, tunable lasers, and high‑speed VCSEL arrays
High‑power, narrow‑linewidth distributed feedback lasers for 10G–100G applications. Available in TO‑can and chip‑on‑carrier.
850nm multimode VCSEL arrays for short‑reach SR4/SR8, 200G/400G AOCs, and active optical cables.
Full C‑band tunable lasers with >80nm tuning range, ideal for coherent transponders and ROADM.
DSP‑free, low‑latency, low‑power transceivers for AI/ML clusters
Linear drive OSFP module without DSP, achieving <4W power consumption and <5ns latency for GPU‑to‑GPU links.
Low‑power 400G linear drive option for short‑reach DCI and rack‑to‑rack interconnects.
Complete evaluation platform for LPO transceivers, including host board, GUI, and compliance testing scripts.
InP, thin‑film lithium niobate, and silicon‑organic hybrid modulators
High‑speed InP modulator for 100Gbaud PAM4 and coherent, low Vπ, small footprint.
Ultra‑low Vπ, high bandwidth modulators for next‑gen 200G/lane and coherent transmission.
High‑speed, low‑power modulator combining silicon photonics with electro‑optic polymers.